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Title:
COPPER FOIL HAVING CARRIER, METHOD FOR PRODUCING COPPER FOIL HAVING CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/080958
Kind Code:
A1
Abstract:
Provided is a copper foil having a carrier, endowed with high cohesive force between the carrier and an ultra-thin copper film prior to the step of lamination to an insulating substrate, the cohesion of the carrier and the ultra-thin copper film not being significantly increased or reduced by the step of lamination to the insulating substrate, affording ease of peeling at the carrier/ultra-thin copper film interface, as well as having reduced migration in circuits formed on the surface, and having good etchability of the ultra-thin copper film. The surface of the ultra-thin copper film of the copper foil having a carrier has an average Rz value, measured in accordance with JIS B0601-1982 using a contact roughness gauge, of 1.5 μm or less, the standard deviation of Rz being 0.1 μm or less. An intermediate layer contains Ni. When the ultra-thin copper film is thermocompression bonded to an insulating substrate, and the ultra-thin copper film is then peeled, in the [0, 1.0] interval during analysis in the depth direction from the surface of the ultra-thin copper film on the intermediate layer side thereof, the requirement that ∫g(x)dx/(∫e(x)dx +∫f(x)dx + ∫g(x)dx + ∫h(x)dx + ∫i(x)dx + ∫j(x)dx+ ∫k(x)dx )is 20.0% or less is met.

Inventors:
HONDA,Misato (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
KOHIKI,Michiya (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
NAGAURA,Tomota (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2013/081326
Publication Date:
May 30, 2014
Filing Date:
November 20, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORPORATION (6-3Otemachi 2-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
International Classes:
C25D1/22; C25D1/04; C25D7/06; H05K1/09
Domestic Patent References:
WO2012046804A12012-04-12
WO2012066991A12012-05-24
WO2010110061A12010-09-30
Foreign References:
JP2008285751A2008-11-27
JP2007146289A2007-06-14
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (Shimbashi i-mark Bldg, 6-2 Shimbashi 2-Chome Minato-k, Tokyo 04, 〒1050004, JP)
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