COPPER FOIL HAVING CARRIER, PRODUCTION METHOD FOR COPPER FOIL HAVING CARRIER, AND COPPER CLAD LAMINATE SHEET AND PRINTED WIRING BOARD OBTAINED USING COPPER FOIL HAVING CARRIER

WIPO Patent Application WO/2015/152380

A1

In order to provide a copper foil having a carrier, said copper foil being resistant to oxidation subsequent to carrier removal, this copper foil having a carrier includes a carrier, a peeling layer, and a copper foil that are laminated in said order and is characterized in that the difference between the lightness (L*) of the peeling surface of the copper foil directly after carrier removal, and the lightness (L*) of the peeling surface after carrier removal and subsequent to the copper foil being left in a humid atmosphere at a constant temperature of 25°C and a humidity of 50-70% for 3 days is within 1.5.

JP6254306	Surface treatment copper foil, copper foil with a career, the manufacturing method of a substrate, a manufacturing method of a printed wired board, a manufacturing method of a printed circuit board, a manufacturing method of a copper-clad laminate sheet
WO/2000/049187	PROCESS FOR MAKING COPPER WIRE INCLUDING SOLVENT EXTRACTION, ELECTRODEPOSITION AND COLD WORKING

TATEOKA AYUMU (JP)
SATO YASUO (JP)
WATANABE HIROYUKI (JP)

PCT/JP2015/060492

October 08, 2015

April 02, 2015

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MITSUI MINING & SMELTING CO (JP)

C25D1/04; B32B15/04; B32B15/08; H05K1/09

JP2001140090A	2001-05-22
JP2014005545A	2014-01-16

YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)

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