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Title:
COPPER FOIL FOR HIGH-DENSITY ULTRAFINE WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2002/024444
Kind Code:
A1
Abstract:
A carrier-equipped ultrathin copper foil which comprises a laminate of a separation layer, a diffusion preventing layer, and an electric copper plating layer, or a diffusion preventing layer, a separation layer, and an electric copper plating layer in this order on the surface of a carrier foil, with a roughened surface of electric copper plating, a copper-clad laminated board comprising a laminate of the caririer-equipped ultrathin copper foil and a resin base, a printed wiring board with a wiring pattern formed on the ultrathin copper foil of the coopper-clad laminated board, and a multilayered wiring board formed by a laminate of a plurality of the printed wiring boards.

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Inventors:
SUZUKI AKITOSHI (JP)
FUKUDA SHIN (JP)
HOSHINO KAZUHIRO (JP)
NAKAOKA TADAO (JP)
Application Number:
PCT/JP2001/008220
Publication Date:
March 28, 2002
Filing Date:
September 21, 2001
Export Citation:
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Assignee:
CIRCUIT FOIL JAPAN (JP)
SUZUKI AKITOSHI (JP)
FUKUDA SHIN (JP)
HOSHINO KAZUHIRO (JP)
NAKAOKA TADAO (JP)
International Classes:
B32B15/08; B32B15/20; C25D1/04; C25D5/10; C25D7/06; H05K3/02; (IPC1-7): B32B15/08; C25D7/06; H05K3/38; H05K3/46
Foreign References:
JPS5720347A1982-02-02
EP0398721A21990-11-22
JP2000331537A2000-11-30
EP0960725A21999-12-01
JPH08181432A1996-07-12
Attorney, Agent or Firm:
Tsukuni, Hajime (Toranomon 1-chome Minato-ku, Tokyo, JP)
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