COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, COPPER-CLAD LAMINATE SHEET, AND PRINTED-WIRING BOARD

Title:

COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT, COPPER-CLAD LAMINATE SHEET, AND PRINTED-WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2017/026490

Kind Code:

A1

Abstract:

According to the present invention, when roughened particles 9 having a height of 0.5-3.0 μm are present as part of the totality, the effect of improvement of adhesion to a resin substrate is great. On the other hand, roughened particles 9 having a height of 0.1-0.4 μm have less of an effect of improvement of adhesion to a resin substrate but have a less adverse impact on high frequency transmission characteristics. Therefore, in the present invention, in a cross-section obtained by cutting a copper foil 5 in a width direction thereof, one to ten roughened particles 9 having a height of 0.5-3.0 μm are present within a 30 μm range, and at least five roughened particles 9 having a height of 0.1-0.4 μm are present within a 30 μm range.

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Inventors:

OKUNO YUKO (JP)
SHINOZAKI KENSAKU (JP)
UNO TAKEO (JP)

Application Number:

PCT/JP2016/073476

Publication Date:

February 16, 2017

Filing Date:

August 09, 2016

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)

International Classes:

H05K1/09; B32B15/04; B32B15/08; B32B15/20; H05K3/38

Foreign References:

JP2006103189A	2006-04-20
JP2005248323A	2005-09-15
JP2006210689A	2006-08-10
JP2011219790A	2011-11-04
JP5204908B1	2013-06-05

Attorney, Agent or Firm:

INOUE, Seiichi (JP)

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