Title:
COPPER FOIL AND ITS MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2005/095677
Kind Code:
A1
Abstract:
A copper foil having a high adhesion strength even though the roughness RZ of the roughened surface of the copper foil is low and its manufacturing method are provided. The relation between the surface coefficient C(S) and the roughness RZ(S) is given by formula (1) 0.5×RZ(S)+0.5≤C(S) (1) where the surface coefficient C(S) is defined by ratio A(S)/B(S) of the three-dimensional surface area A(S) of the roughened surface of a copper foil sample (S) three-dimensionally measured with a laser microscope to the measurement portion area B(S) which is the area of the measurement portion of the three-dimensional surface area A(S) and the roughness RZ(S) is the roughness of the roughened surface of the copper foil sample (S) measured by means of a roughness tester of tracer type and has a value in micrometers. The value of the roughness RZ(S) is 1.0 to 3.0 μm. Such a copper foil is adopted.
Inventors:
IWAKIRI KENICHIRO (JP)
NAGATANI SEIJI (JP)
NAGATANI SEIJI (JP)
Application Number:
PCT/JP2005/006293
Publication Date:
October 13, 2005
Filing Date:
March 31, 2005
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
IWAKIRI KENICHIRO (JP)
NAGATANI SEIJI (JP)
IWAKIRI KENICHIRO (JP)
NAGATANI SEIJI (JP)
International Classes:
C25D7/06; H05K3/38; H05K1/09; (IPC1-7): C25D7/06; H05K1/09
Foreign References:
| JPH10341066A | 1998-12-22 | |||
| JPH07231152A | 1995-08-29 | |||
| JPH11340595A | 1999-12-10 | |||
| JP2001214297A | 2001-08-07 |
Other References:
See also references of EP 1748092A4
Attorney, Agent or Firm:
Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F bldg. 5-4, Sakuragicho 2-chome,
Omiya-ku, Saitama-sh, Saitama 54, JP)
Download PDF:
Previous Patent: COMPACT SERVICE MODULE WHICH IS INTENDED FOR ELECTROLYTIC ALUMINIUM PRODUCTION PLANTS
Next Patent: ELECTROPLATING SYSTEM AND METHOD
Next Patent: ELECTROPLATING SYSTEM AND METHOD