Title:
COPPER FOIL FOR LAMINATION
Document Type and Number:
WIPO Patent Application WO/2013/047056
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copper foil for lamination, said copper foil exhibiting excellent adhesion to a substrate and being capable of forming a high-precision wiring pattern. This copper foil for lamination is a copper foil to be laminated on a substrate, wherein the surface roughness (Rz) on the side to be faced to the substrate is 0.500μm or less, and the fractal dimension of a cross-sectional profile on the side to be faced to the substrate is 1.020 to 1.400 as calculated by applying a box counting method wherein the side length of the square boxes is set to 1 to 10nm.
Inventors:
UEKI SHIKI (JP)
Application Number:
PCT/JP2012/071684
Publication Date:
April 04, 2013
Filing Date:
August 28, 2012
Export Citation:
Assignee:
FUJIFILM CORP (JP)
UEKI SHIKI (JP)
UEKI SHIKI (JP)
International Classes:
H05K1/09; B32B15/08; C25D1/04; H05K3/38
Domestic Patent References:
| WO2009084540A1 | 2009-07-09 | |||
| WO2009001665A1 | 2008-12-31 | |||
| WO2010073903A1 | 2010-07-01 |
Foreign References:
| JP2006286724A | 2006-10-19 | |||
| JP2003239082A | 2003-08-27 | |||
| JPH05167264A | 1993-07-02 | |||
| JP2010185128A | 2010-08-26 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
Download PDF:
Claims: