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Title:
COPPER FOIL FOR LASER PROCESSING, CARRIER-FOIL-SUPPORTED COPPER FOIL FOR LASER PROCESSING, COPPER-CLAD LAMINATE, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/136763
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a copper foil for laser processing which has excellent laser processability and from which a wiring pattern can be satisfactorily formed; a carrier-foil-supported copper foil for laser processing, a copper-clad laminate, and a process for producing a printed wiring board. This copper foil for laser processing comprises a copper foil and, formed on a surface thereof, a sparingly soluble laser-light-absorbing layer which can be etched with copper etchants but has a lower etching rate than the copper foil and which absorbs infrared laser light.

Inventors:
MATSUDA MITSUYOSHI (JP)
YOSHIKAWA KAZUHIRO (JP)
HARA YASUJI (JP)
FUJIMOTO TAKAO (JP)
Application Number:
JP2014/055446
Publication Date:
September 12, 2014
Filing Date:
March 04, 2014
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D7/06; C25D3/58; H05K3/00
Domestic Patent References:
WO2002024444A12002-03-28
WO2011086972A12011-07-21
Foreign References:
JP2002176242A2002-06-21
JPH0681172A1994-03-22
JP2001288595A2001-10-19
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
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