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Title:
COPPER FOIL AND MANUFACTURING METHOD THEREFOR, COPPER FOIL WITH CARRIER AND MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2012/046804
Kind Code:
A1
Abstract:
Provided is a copper foil with carrier capable of providing wirings of line/space=15 μm/15 μm or less on a printed circuit board on which copper foils are laminated. Also provided are a printed circuit board and a multilayer printed circuit board capable of providing wirings with fine patterns of line/space=15 μm/15 μm or less using the copper foil. A copper foil with carrier obtained by laminating a release layer and a copper foil in this order on a carrier foil having an average interval Sm of 25 μm or more between irregularities of a substrate crest on the surface, the Sm being defined in JIS-B-06012-1994, and by laminating a release layer and a copper foil in this order on a carrier foil which is a copper foil obtained by peeling the former copper foil from the former carrier foil, wherein the interval between irregularities of a substrate crest on the surface of the carrier foil on which copper foils are laminated is 25 μm or more as the average interval Sm defined in JIS-B-06012-1994. A roughening process layer and a surface treatment layer are laminated in this order on the surface of the copper foil as needed.

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Inventors:
KAWAKAMI AKIRA (JP)
Application Number:
PCT/JP2011/073097
Publication Date:
April 12, 2012
Filing Date:
October 06, 2011
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
KAWAKAMI AKIRA (JP)
International Classes:
C25D1/04; C25D7/06; H05K1/09
Foreign References:
JP2005076091A2005-03-24
KR20100106934A2010-10-04
JP2005307270A2005-11-04
JP2005254673A2005-09-22
JP2003311880A2003-11-06
JP2006281249A2006-10-19
JP2005161840A2005-06-23
JP2000269637A2000-09-29
JP2005076091A2005-03-24
JP3313277B22002-08-12
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
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Claims:



 
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