Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COPPER FOIL AND A METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2010/147013
Kind Code:
A1
Abstract:
Disclosed is a copper foil obtained by providing a plating layer containing nickel and zinc upon an electrolytic copper foil or a rolled copper foil, and providing a chrome plating layer upon said plating layer that contains nickel and zinc. The copper foil is characterized in that the zinc in the plating layer that contains nickel and zinc consists of zinc oxide and metallic zinc, and in that the proportion of metallic zinc in said zinc oxide and metallic zinc is 50% or less. The copper foil has an excellent degree of adhesion to the polyimide resin layer and excellent resistance to acid and tin plating solutions, exhibits a high peel strength, a good ability to be etched, and a good degree of glossiness, and allows the formation of finer circuit patterns, and thus is suited for use in a flexible printed substrate that forms a polyimide resin layer.

Inventors:
KAMINAGA KENGO (JP)
Application Number:
PCT/JP2010/059602
Publication Date:
December 23, 2010
Filing Date:
June 07, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JX NIPPON MINING & METALS CORP (JP)
KAMINAGA KENGO (JP)
International Classes:
C25D7/06; B32B15/01; C25D5/12; H05K1/09
Foreign References:
JP2002217507A2002-08-02
JPS56155592A1981-12-01
JP2005344174A2005-12-15
JP2007165674A2007-06-28
JP2007007937A2007-01-18
JP2002217507A2002-08-02
JPS56155592A1981-12-01
JP2005344174A2005-12-15
JP2007165674A2007-06-28
JP2007007937A2007-01-18
Other References:
See also references of EP 2444530A4
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
Download PDF: