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Title:
COPPER FOIL FOR PRINTED CIRCUIT BOARD, METHOD OF PREPARING THE SAME, AND FLEXIBLE COPPER CLAD LAMINATE USING POLYAMIC ACID PRECURSOR AND COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2010/008214
Kind Code:
A3
Abstract:
Provided is a surface-treated copper foil for a printed circuit board (PCB), including an antirust layer formed on a copper foil and a surface treatment film formed on the antirust layer, wherein the surface treatment film includes at least one compound selected from the group consisting of silane-based compounds represented by Formulae 1 through 4, or hydrolysates of the silane-based compounds: wherein R1, R2, and R3 are each independently a C1-C3 alkyl group and R4 and R5 are each independently hydrogen or a C1-C5 alkyl group.

Inventors:
RYU JONG HO (KR)
WON JONG CHAN (KR)
KIM YONG SEOK (KR)
JUNG HYUN MIN (KR)
PARK JIN YOUNG (KR)
Application Number:
PCT/KR2009/003914
Publication Date:
May 14, 2010
Filing Date:
July 16, 2009
Export Citation:
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Assignee:
ILJIN COPPER FOIL CO LTD (KR)
RYU JONG HO (KR)
WON JONG CHAN (KR)
KIM YONG SEOK (KR)
JUNG HYUN MIN (KR)
PARK JIN YOUNG (KR)
International Classes:
C23C28/00
Foreign References:
KR20080014555A2008-02-14
KR100651386B12006-11-29
JP2006299320A2006-11-02
KR20010089948A2001-10-17
Attorney, Agent or Firm:
Y.P. LEE, MOCK & PARTNERS (Seocho-gu, Seoul 137-875, KR)
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