Title:
COPPER FOIL FOR PRINTED CIRCUIT BOARD, METHOD OF PREPARING THE SAME, AND FLEXIBLE COPPER CLAD LAMINATE USING POLYAMIC ACID PRECURSOR AND COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2010/008214
Kind Code:
A3
Abstract:
Provided is a surface-treated copper foil for a printed circuit board (PCB), including an antirust layer formed on a copper foil and a surface treatment film formed on the antirust layer, wherein the surface treatment film includes at least one compound selected from the group consisting of silane-based compounds represented by Formulae 1 through 4, or hydrolysates of the silane-based compounds: wherein R1, R2, and R3 are each independently a C1-C3 alkyl group and R4 and R5 are each independently hydrogen or a C1-C5 alkyl group.
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Inventors:
RYU JONG HO (KR)
WON JONG CHAN (KR)
KIM YONG SEOK (KR)
JUNG HYUN MIN (KR)
PARK JIN YOUNG (KR)
WON JONG CHAN (KR)
KIM YONG SEOK (KR)
JUNG HYUN MIN (KR)
PARK JIN YOUNG (KR)
Application Number:
PCT/KR2009/003914
Publication Date:
May 14, 2010
Filing Date:
July 16, 2009
Export Citation:
Assignee:
ILJIN COPPER FOIL CO LTD (KR)
RYU JONG HO (KR)
WON JONG CHAN (KR)
KIM YONG SEOK (KR)
JUNG HYUN MIN (KR)
PARK JIN YOUNG (KR)
RYU JONG HO (KR)
WON JONG CHAN (KR)
KIM YONG SEOK (KR)
JUNG HYUN MIN (KR)
PARK JIN YOUNG (KR)
International Classes:
C23C28/00
Foreign References:
KR20080014555A | 2008-02-14 | |||
KR100651386B1 | 2006-11-29 | |||
JP2006299320A | 2006-11-02 | |||
KR20010089948A | 2001-10-17 |
Attorney, Agent or Firm:
Y.P. LEE, MOCK & PARTNERS (Seocho-gu, Seoul 137-875, KR)
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