Title:
COPPER FOIL FOR PRINTED CIRCUIT BOARD AND LAMINATED PLATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/047847
Kind Code:
A1
Abstract:
The present invention provides a copper foil for a printed circuit board and a laminated plate using the same which make it possible to form a circuit with a trapezoidal cross-section having a small footing, which is suitable for making fine pitches. The copper foil for printed circuit board has a copper foil material and a cover layer for covering at least a part of the surface of the copper foil material. The cover layer to which electrons flow from the copper foil during etching is formed on the surface where a resist pattern during the etching is formed.
Inventors:
FURUSAWA HIDEKI (JP)
Application Number:
PCT/JP2012/075266
Publication Date:
April 04, 2013
Filing Date:
September 28, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
H05K1/09; B32B15/01; H05K3/00
Foreign References:
| JP2011166018A | 2011-08-25 | |||
| JP2011171621A | 2011-09-01 | |||
| JP2002176242A | 2002-06-21 | |||
| JP2007243043A | 2007-09-20 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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Claims: