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Title:
COPPER FOIL FOR PRINTED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2013/065831
Kind Code:
A1
Abstract:
Provided is a roughened copper foil that has a black surface and good etching properties. This copper foil for a printed circuit has a non-black roughened layer and a nickel-tungsten alloy plating layer formed in this order on at least one of the surfaces of the copper foil, and the amount of nickel in the nickel-tungsten alloy plating layer is 2,000 µg/dm2 or more.

Inventors:
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
Application Number:
PCT/JP2012/078509
Publication Date:
May 10, 2013
Filing Date:
November 02, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; H05K1/09
Domestic Patent References:
WO2011138876A12011-11-10
Foreign References:
JP2006210689A2006-08-10
JP2003171781A2003-06-20
JP3295308B22002-06-24
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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