COPPER FOIL FOR PRINTED WIRING BOARD AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO2010110092

A1

Disclosed is a copper foil for a printed wiring board, which is characterized by comprising, on at least one surface thereof, a roughened layer that is composed of needle-like fine roughening particles each having a diameter of 0.1-2.0 µm and an aspect ratio of not less than 1.5. Also disclosed is a method for producing a copper foil for a printed wiring board, which is characterized in that a roughened layer that is composed of needle-like fine roughening particles each having a diameter of 0.1-2.0 µm and an aspect ratio of not less than 1.5 is formed on at least one surface of a copper foil, using an electrolytic bath that is composed of sulfuric acid/copper sulfate and contains at least one substance selected from among an alkyl sulfate salt, tungsten ions and arsenic ions. Consequently, a copper foil for a semiconductor package substrate, which is capable of preventing circuit erosion without deteriorating the other characteristics of the copper foil, can be obtained. In particular, a copper foil for a printed wiring board, which has an improved roughened layer and is thus increased in adhesion strength to a resin, can be obtained. The method for producing a copper foil for a printed wiring board enables the production of such a copper foil.

AKASE FUMIAKI (JP)

PCT/JP2010/054224

September 30, 2010

March 12, 2010

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NIPPON MINING CO (JP)
AKASE FUMIAKI (JP)

H05K1/09; B32B15/16; C23C22/24; C25D7/06; C25D9/08

JPH07231152A	1995-08-29
JP2007042696A	2007-02-15
JP2006278882A	2006-10-12
JPH06169169A	1994-06-14
JPH08236930A	1996-09-13
JP2007501330A	2007-01-25
JPS5515216A	1980-02-02

OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)

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