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Title:
COPPER FOIL FOR PRINTED WIRING BOARD HAVING EXCELLENT THERMAL DISCOLORATION RESISTANCE AND ETCHING PROPERTIES, AND LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/121803
Kind Code:
A1
Abstract:
Disclosed are: a copper foil for a printed wiring board, which exhibits good etching properties when a circuit pattern is formed and is suitable for the formation of a fine pitch pattern, while having good discoloration resistance; and a laminate using the copper foil for a printed wiring board. Specifically disclosed is a copper foil for a printed wiring board, which comprises a copper foil base and a coating layer that covers at least a part of the surface of the copper foil base. The coating layer contains at least one element selected from among Ni, Zn, Sn, V, Mn, Co and Ag, and at least one element selected from among Pt, Pd and Au.

Inventors:
FURUSAWA,Hideki (JX Nippon Mining & Metals Corporation1-2, Shirogane-cho 1-chome, Hitachi-sh, Ibaraki 56, 〒3170056, JP)
古澤 秀樹 (〒56 茨城県日立市白銀町1-1-2 JX日鉱日石金属株式会社技術開発センター内 Ibaraki, 〒3170056, JP)
Application Number:
JP2010/059372
Publication Date:
October 06, 2011
Filing Date:
June 02, 2010
Export Citation:
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Assignee:
JX Nippon Mining & Metals Corporation (6-3 Otemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
JX日鉱日石金属株式会社 (〒04 東京都千代田区大手町二丁目6番3号 Tokyo, 〒1000004, JP)
FURUSAWA,Hideki (JX Nippon Mining & Metals Corporation1-2, Shirogane-cho 1-chome, Hitachi-sh, Ibaraki 56, 〒3170056, JP)
International Classes:
H05K1/09; C23C26/00; C23F1/18
Attorney, Agent or Firm:
AXIS Patent International (Yushi Kogyo Kaikan, 13-11Nihonbashi 3-chome,Chuo-k, Tokyo 27, 〒1030027, JP)
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