Title:
COPPER FOIL FOR PRINTED WIRING BOARD AND LAMINATED BODY USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/027444
Kind Code:
A1
Abstract:
Provided is a copper foil for a printed wiring board, which is capable of being used in the manufacture of a circuit that is suitable for fine-pitch wiring and has a cross-sectional shape with a small footing, and also provided is a laminated body using the copper foil. The copper foil for a printed wiring board comprises a copper foil substrate and a coating layer that covers at least part of the surface of this copper foil substrate and contains one or more selected from the group consisting of Au, Pt and Pd. The amount of Au deposited in this coating layer is less than 200 µg/dm2, the amount of Pt being less than 200 µg/dm2 and the amount of Pd being less than 120 µg/dm2.
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Inventors:
FURUSAWA HIDEKI (JP)
TANAKA KOICHIRO (JP)
TANAKA KOICHIRO (JP)
Application Number:
PCT/JP2012/059550
Publication Date:
February 28, 2013
Filing Date:
April 06, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
FURUSAWA HIDEKI (JP)
TANAKA KOICHIRO (JP)
FURUSAWA HIDEKI (JP)
TANAKA KOICHIRO (JP)
International Classes:
H05K1/09; C22C5/02; C22C5/04; C22C19/03; C22C19/07; C23F1/18; H05K3/06
Domestic Patent References:
| WO2010087268A1 | 2010-08-05 | |||
| WO2010147059A1 | 2010-12-23 |
Foreign References:
| JP2002176242A | 2002-06-21 | |||
| JP2005101398A | 2005-04-14 | |||
| JP2006261270A | 2006-09-28 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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Claims: