Title:
COPPER FOIL FOR PRINTED WIRING BOARD, AS WELL AS LAMINATE, PRINTED WIRING BOARD, AND ELECTRONIC COMPONENT USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/115382
Kind Code:
A1
Abstract:
Provided is a copper foil for a printed wiring board that enables circuits that are suitable for fine pitches and have a cross-sectional shape with small footings to be manufactured at satisfactory cost. A copper foil for a printed wiring board provided with a copper foil substrate, and a surface-treated layer formed on at least a part of the surface of the copper foil substrate, Mo being deposited on the surface-treated layer at in an amount of no greater than 2000 μg/dm2.
Inventors:
FURUSAWA HIDEKI (JP)
Application Number:
PCT/JP2013/052389
Publication Date:
August 08, 2013
Filing Date:
February 01, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C30/00; C23C14/14; C25D7/06; H05K1/09
Foreign References:
| JP2011129685A | 2011-06-30 | |||
| JPS62216287A | 1987-09-22 | |||
| JPS61253886A | 1986-11-11 | |||
| JP2009206514A | 2009-09-10 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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