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Patent Searching and Data


Title:
COPPER FOIL FOR PRINTED WIRING BOARD, AND COPPER-CLAD LAMINATED BOARD
Document Type and Number:
WIPO Patent Application WO/2016/038923
Kind Code:
A1
Abstract:
[Problem] To provide a copper foil for a wiring board which exhibits good visibility after forming a circuit pattern and high peel strength under normal conditions and in which heat-resistant peel strength is maintained at a high level; and a copper-clad laminated board. [Solution] Provided is a copper foil having, on at least one surface of the copper foil, a roughened particle layer comprising roughened particles having an arithmetic mean height of 0.05-0.5 μm, and having, on the roughened particle layer, a diffusion prevention coating layer, which contains at least nickel and zinc and in which the (mass) ratio of the quantity of nickel deposited on the roughened particle layer relative to the quantity of zinc deposited on the roughened particle layer falls within the range 0.5-20, wherein the diffused reflectance (Rd) at a wavelength of 600 nm, as measured from the side of the one surface, falls within the range 5-50% and the chroma (C*) is 30 or lower. Also provided is a copper-clad laminated board having a polyimide resin layer, which contains a specific copper inhibitor, on the one surface of the copper foil.

Inventors:
FUJITA RYOTA (JP)
KAWANAKAI HIROFUMI (JP)
Application Number:
PCT/JP2015/061878
Publication Date:
March 17, 2016
Filing Date:
April 17, 2015
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D7/06; B32B15/01; B32B15/088; H05K1/09
Foreign References:
JP2011149067A2011-08-04
JP2004269959A2004-09-30
JP2011044550A2011-03-03
JP2009019132A2009-01-29
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
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