Title:
COPPER FOIL FOR PRINTED WIRING BOARDS, AND LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/128009
Kind Code:
A1
Abstract:
Provided are: a copper foil for printed wiring boards, which enables circuits that are suitable for fine pitches and have a cross-sectional shape with small footings to be efficiently manufactured; and a laminate that uses the copper foil. The copper foil for printed wiring boards is provided with a copper foil substrate, and a covering layer that covers at least part of the surface of the copper foil substrate. The covering layer is composed of: a first layer comprising at least one of Pt, Pd and Au, which are laminated in order from the surface of the copper foil substrate; and a second layer comprising one or more types of metal among Ni, Co, Sn, Zn, Cu, and Cr. Au, Pt, Pd, Ni, Co, Sn, Zn, Cu, and Cr are present in the coating layer at coating amounts of 200 to 2000 μg/dm2, 200 to 2000 μg/dm2, 120 to 1200 μg/dm2, 5 to 1500 μg/dm2, 5 to 1500 μg/dm2, 5 to 1200 μg/dm2, 5 to 1200 μg/dm2, 5 to 1500 μg/dm2, and 5 to 80 μg/dm2, respectively. The thickness of the coating layer is 3 to 25 nm. If the atomic concentration (%) of the at least one of Pt, Pd, and Au in the depth direction (x; unit: nm) obtained by XPS depth profiling from the surface is regarded as f(x), the atomic concentration of the at least one metal among Ni, Co, Sn, Zn, Cu, and Cr is regarded as g(x), and first maximum values for f(x) and g(x) in the interval [0, 15] are regarded as f(F) and g(G), respectively, G ≤ F, f(F) ≥ 1%, and g(G) ≥ 1% are satisfied.
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Inventors:
FURUSAWA HIDEKI (JP)
TANAKA KOICHIRO (JP)
TANAKA KOICHIRO (JP)
Application Number:
PCT/JP2012/055113
Publication Date:
September 27, 2012
Filing Date:
February 29, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
FURUSAWA HIDEKI (JP)
TANAKA KOICHIRO (JP)
FURUSAWA HIDEKI (JP)
TANAKA KOICHIRO (JP)
International Classes:
H05K1/09; B32B15/01; B32B15/04; C23C30/00
Domestic Patent References:
| WO2010087268A1 | 2010-08-05 | |||
| WO2010147059A1 | 2010-12-23 | |||
| WO2011001551A1 | 2011-01-06 | |||
| WO2011001552A1 | 2011-01-06 |
Foreign References:
| JPH05235542A | 1993-09-10 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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Claims:
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