Title:
COPPER FOIL PROCESSING METHOD, COPPER FOIL, LAMINATE, COPPER-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND MODULE CORRESPONDING TO HIGH-SPEED COMMUNICATION
Document Type and Number:
WIPO Patent Application WO/2020/017524
Kind Code:
A1
Abstract:
Provided is a copper foil processing method by which, regardless of the type of resin composition or the type of resin of a resin layer to be laminated on a conductive layer, peeling off of the resin layer is unlikely to occur even after a reflow step. Further provided are a copper foil obtained by performing the copper foil processing method, and a laminate using the copper foil, a copper-clad laminated plate, a printed wiring board, and a module suitable for high-speed communication. Specifically, provided is a copper foil processing method including: a step (1) for forming a tin layer or a tin alloy layer on the surface of a copper foil; a step (2) for converting, to a tin oxide, tin present on the surface of the tin layer or the tin alloy layer; and a step (3) for performing a coupling process on the tin oxide.
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Inventors:
JONO KEITA (JP)
NAKANO MASAYUKI (JP)
NAKANO MASAYUKI (JP)
Application Number:
PCT/JP2019/028003
Publication Date:
January 23, 2020
Filing Date:
July 17, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B15/01; B32B15/08; C23C8/12; C23C18/31; C23C28/00; H05K3/38
Foreign References:
| JP2011091066A | 2011-05-06 | |||
| JPH04363095A | 1992-12-15 | |||
| JP2013170266A | 2013-09-02 | |||
| JP2004266170A | 2004-09-24 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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