Title:
COPPER FOIL PROVIDED WITH CARRIER
Document Type and Number:
WIPO Patent Application WO/2014/042201
Kind Code:
A1
Abstract:
Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper layer layered onto the release layer; wherein the very thin copper layer has been roughened and the Rz of the very thin copper layer surface is 1.6 μm or less as measured with a non-contact roughness meter.
Inventors:
KOHIKI MICHIYA (JP)
NAGAURA TOMOTA (JP)
SAKAGUCHI KAZUHIKO (JP)
CHIBA TORU (JP)
NAGAURA TOMOTA (JP)
SAKAGUCHI KAZUHIKO (JP)
CHIBA TORU (JP)
Application Number:
PCT/JP2013/074585
Publication Date:
March 20, 2014
Filing Date:
September 11, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D1/04; C25D7/06; H05K1/09
Domestic Patent References:
| WO2012046804A1 | 2012-04-12 |
Foreign References:
| JP2010236072A | 2010-10-21 | |||
| JP2012169598A | 2012-09-06 | |||
| JP2008285751A | 2008-11-27 | |||
| JP2011009267A | 2011-01-13 | |||
| JP2007314855A | 2007-12-06 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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