COPPER FOIL FOR TRANSPARENT RESIN BASE MATERIAL, AND TRANSPARENT RESIN BASE MATERIAL HAVING FINE COPPER WIRING

WIPO Patent Application WO/2015/178455

A1

The invention of the present application addresses the problem of providing: a copper foil for a transparent resin base material, which is suitable for use when forming, on a surface of a transparent resin base material, ultrafine copper wiring having a high scratch resistance, high resistance to dissolution in acids and a high anti-reflection effect; a transparent resin base material having fine copper wiring; and a method for producing a transparent resin base material having fine copper wiring. In order to solve this problem, as a copper foil for a transparent resin base material which is for forming copper wiring on a surface of a transparent resin base material, provided is a copper foil for a transparent resin base material which is characterized by providing a surface of a copper foil with a layer having a fine uneven structure, which contains cuprous oxide and cupric oxide and which has a fine uneven structure consisting of these complex copper compounds and formed from needle-like or plate-like protruding portions having a maximum length of 500 nm or less.

TATEOKA AYUMU (JP)
OBATA SHINICHI (JP)
IIDA HIROTO (JP)
WATANABE HIROYUKI (JP)

PCT/JP2015/064630

November 26, 2015

May 21, 2015

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MITSUI MINING & SMELTING CO (JP)

C23C26/00; B32B15/08; B32B15/20; H01B5/14

WO2013176133A1

2013-11-28

JPS56153797A	1981-11-27
JP2008248269A	2008-10-16
JP2006021455A	2006-01-26
JP2011174132A	2011-09-08

YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)

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