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Title:
COPPER FOIL WITH ATTACHED CARRIER FOIL, METHOD FOR MANUFACTURING COPPER FOIL WITH ATTACHED CARRIER FOIL, AND COPPER CLAD LAMINATE BOARD FOR LASER BEAM DRILLLING OBTAINED BY USING COPPER FOIL WITH ATTACHED CARRIER FOIL
Document Type and Number:
WIPO Patent Application WO/2013/129508
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve processing performance in laser beam drilling a copper clad laminate board, a blackening treated surface of said copper clad laminate board being to be used as a treatment surface in the laser beam drilling. To achieve this purpose, a copper foil (1) with attached carrier foil is provided, said copper foil (1) with attached carrier foil having a layered structure consisting of a carrier foil (2)/a release layer (3)/a bulk copper layer (4) and being characterized in that metal component-containing grains (5) are disposed between the release layer (3) and the bulk copper layer (4). When a copper clad laminate board is manufactured by using this copper foil with attached carrier foil, a blackening treated layer with a color that ensures excellent laser beam drilling performance can be formed on the surface of the bulk copper layer.

Inventors:
YOSHIKAWA KAZUHIRO (JP)
Application Number:
PCT/JP2013/055208
Publication Date:
September 06, 2013
Filing Date:
February 27, 2013
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D1/04; B32B7/06; B32B15/04; C25D7/06; C25D15/00; H05K1/09; H05K3/00
Foreign References:
JP2005048277A2005-02-24
JP2001062955A2001-03-13
JP2009235580A2009-10-15
JPH11261216A1999-09-24
JP2001068816A2001-03-16
Other References:
TOSHIKI HIROGAKI ET AL.: "Direct Laser Drilling in Copper Clad Printed Wiring Boards : Effect of Surface Treatment on Drilled Blind Via-Hole Quality", TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS, SERIES A, vol. 74, no. 747, 25 November 2008 (2008-11-25), pages 1411 - 1417, XP055160268
See also references of EP 2821528A4
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
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Claims: