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Title:
COPPER FOIL WITH ATTACHED CARRIER, COPPER-CLAD LAMINATE USING SAME, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2014/136785
Kind Code:
A1
Abstract:
Provided is a copper foil with an attached carrier, said copper foil being suitable for fine-pitch pattern formation. Said copper foil is provided with the following, in this order: a carrier, i.e. a support; an intermediate layer; and an ultrathin copper layer. At least one side of said ultrathin copper layer has an Rz, as measured by a non-contact surface roughness tester, of 0.5 µm or less.

Inventors:
SAKAGUCHI KAZUHIKO (JP)
SASAKI SHINICHI (JP)
Application Number:
JP2014/055494
Publication Date:
September 12, 2014
Filing Date:
March 04, 2014
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B32B15/08; B32B15/01; C25D7/06; H05K1/09
Domestic Patent References:
WO2014042201A12014-03-20
Foreign References:
JP2004169181A2004-06-17
JP2005076091A2005-03-24
JP2007186782A2007-07-26
JP2010222657A2010-10-07
JP2011176051A2011-09-08
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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