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Title:
COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE USING COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND PRINTED WIRING BOARD PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2014/065430
Kind Code:
A1
Abstract:
Provided is a copper foil with a carrier in which there are no limits to the types of ultra-thin copper layers and carriers, nor to the thicknesses of the copper layers and carriers, and in which warping of the copper foil is satisfactorily suppressed. The copper foil with a carrier is provided with a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultra-thin copper layer laminated on the intermediate layer. The residual stress of the outer surface of the copper foil carrier, and the residual stress of the outer surface of the ultra-thin copper layer are both contraction stresses or are both tensile stresses.

Inventors:
MORIYAMA,Terumasa (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
SAKAGUCHI,Kazuhiko (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
NAGAURA,Tomota (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
KOHIKI,Michiya (JX Nippon Mining & Metals Corporation3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2013/079165
Publication Date:
May 01, 2014
Filing Date:
October 28, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORPORATION (6-3Otemachi 2-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
International Classes:
B32B15/20; B21B3/00; C25D1/04; H05K1/09; C25D5/12; C25D7/06
Domestic Patent References:
WO2010047228A1
Foreign References:
JP2000331537A
JP2012209432A
JP2011253879A
JP2006100533A
JP2008270443A
JPH04372145A
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (Shimbashi i-mark Bldg, 6-2 Shimbashi 2-Chome Minato-k, Tokyo 04, 〒1050004, JP)
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