COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRIC APPLIANCE, RESIN LAYER, PRODUCTION METHOD FOR COPPER FOIL WITH CARRIER, AND PRODUCTION METHOD FOR PRINTED WIRING BOARD

WIPO Patent Application WO/2014/196576

A1

Provided is a copper foil with a carrier, in which the peeling strength and the adhesive strength between an ultrathin copper layer and a resin base material is increased without causing the various other properties of the copper foil with a carrier to deteriorate, and without the surface roughness of the ultrathin copper layer of the copper foil with a carrier being increased. Also provided is a production method for the same. The copper foil with a carrier includes, in order, the carrier, an intermediate layer, the ultrathin copper layer, and a roughened layer. The roughened layer comprises roughening particles such that the average value of the diameter averages is 0.05-1.3μm, the average value of the length averages is 0.3-3.0μm, and a value (A) {A = the difference (μm) between the maximum and minimum values of the diameter averages / the average value (μm) of the diameter averages of the roughening particles}, which is the difference between the maximum and minimum values of the diameter averages divided by the average value of the diameter averages, of 0.6 or less.

NAGAURA TOMOTA (JP)
MORIYAMA TERUMASA (JP)

PCT/JP2014/064874

December 11, 2014

June 04, 2014

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JX NIPPON MINING & METALS CORP (JP)

C25D7/06

WO2013031913A1

2013-03-07

AXIS Patent International (JP)
Axis international patent business corporation (JP)

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