COPPER FOIL, COPPER FOIL WITH CARRIER FOIL, AND COPPER-CLAD LAMINATE

WIPO Patent Application WO/2015/040998

A1

The purpose of the present invention is to provide a copper foil that has better adhesiveness with an insulating resin substrate than an unroughened copper foil and has etchability as good as that of an unroughened copper foil. In order to achieve this purpose, used is a copper foil comprising a layer subjected to a roughening treatment on at least one surface of the copper foil, the copper foil being characterized in that the layer subjected to the roughening treatment comprises a composite copper compound and has a fine irregular structure formed from needle-shaped or plate-shaped convex sections with sizes of 500 nm or less, and in that a layer treated with a silane coupling agent is disposed on the surface of the layer subjected to the roughening treatment. Alternatively, used is a copper foil with a carrier foil comprising a carrier foil/joint interface layer/copper foil layer structure, the copper foil being characterized in that, on the surface of the copper foil layer, disposed is a layer subjected to a roughening treatment that comprises a composite copper compound and that has a fine irregular structure formed from needle-shaped or plate-shaped convex sections with sizes of 500 nm or less, and in that a layer treated with a silane coupling agent is disposed on the surface of the layer subjected to the roughening treatment.

TSUYOSHI HIROAKI (JP)
HOSOKAWA MAKOTO (JP)

PCT/JP2014/071798

March 26, 2015

August 20, 2014

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MITSUI MINING & SMELTING CO (JP)

C25D7/06; C25D1/04; H05K1/09; H05K3/38

WO2010110092A1

2010-09-30

JP2006249519A	2006-09-21
JP2003008199A	2003-01-10
JP2010236058A	2010-10-21
JP2002060965A	2002-02-28
JP2009221592A	2009-10-01
JP2014148692A	2014-08-21

YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)

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