Title:
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/150284
Kind Code:
A1
Abstract:
Provided is a copper foil with a carrier, which exhibits excellent peeling resistance to a developing solution during a photoresist development step and which is capable of demonstrating excellent stability with respect to the mechanical peeling strength of a carrier. This copper foil with a carrier comprises: a carrier; an intermediate layer disposed on the carrier where the surface on the carrier side contains at least 1.0 at% of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and the surface on the side opposite the carrier contains at least 30 at% of Cu; a peelable layer disposed on the intermediate layer; and an ultrathin copper layer disposed on the peelable layer.
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Inventors:
MATSUURA YOSHINORI (JP)
Application Number:
PCT/JP2017/006423
Publication Date:
September 08, 2017
Filing Date:
February 21, 2017
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C23C14/06; B32B7/06; B32B15/04; C23C14/14; C23C28/00; H01L23/12; H05K1/09; H05K3/46
Domestic Patent References:
| WO2012133638A1 | 2012-10-04 |
Foreign References:
| JP5859155B1 | 2016-02-10 | |||
| JP2007307767A | 2007-11-29 | |||
| JPS6134385B2 | 1986-08-07 | |||
| JP2012094682A | 2012-05-17 | |||
| JP2015050314A | 2015-03-16 | |||
| JP2016026914A | 2016-02-18 | |||
| JP2005502496A | 2005-01-27 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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