Title:
COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2015/080227
Kind Code:
A1
Abstract:
Provided is a copper foil with a carrier, which comprises an ultrathin copper layer having a surface with good circuit formation properties. This copper foil with a carrier sequentially comprises a carrier, an intermediate layer and an ultrathin copper layer in this order. The surface of the ultrathin copper layer has an absorptance of 85% or more with respect to light having a wavelength of 400 nm.
Inventors:
NAGAURA TOMOTA (JP)
Application Number:
PCT/JP2014/081468
Publication Date:
June 04, 2015
Filing Date:
November 27, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D1/04; B32B15/01; B32B15/08; C25D7/06; H05K3/20
Foreign References:
| JP2008211156A | 2008-09-11 | |||
| JPH08279672A | 1996-10-22 | |||
| JP2005288856A | 2005-10-20 | |||
| JP2013503965A | 2013-02-04 | |||
| JP2002076578A | 2002-03-15 | |||
| JP2013239677A | 2013-11-28 |
Other References:
NAOKI FUKUTOMI ET AL.: "Special Articles: Recent Trends on MCM and Bare LSI Chip Mounting. Manufacturing Process of PWBs for the Substrate of MCM and Bare Chip Mounting. Transfer Lamination Method", CIRCUIT TECHNOLOGY, vol. 9, no. 5, August 1994 (1994-08-01), pages 369 - 376
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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