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Title:
COPPER FOIL WITH CARRIER, MANUFACTURING METHOD FOR COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD AND COPPER CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2013/118416
Kind Code:
A1
Abstract:
A copper foil with a carrier provided with a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer. The intermediate layer is configured by laminating nickel and chromate in said order on the copper foil carrier. The amount of adhering nickel is 100-40000 µg/dm2 and the amount of adhering chromium is 5-100 µg/dm2. If, when peeling between the intermediate layer and the ultrathin copper layer, the chromium atom concentration in the depth direction (x: in nm units) obtained from analysis in the depth direction from the surface using XPS is f(x), the nickel atom concentration is g(x) and the concentration of other atoms is l(x), the copper foil with a carrier satisfies ∫f(x)dx/(∫f(x)dx+∫g(x)dx+∫l(x)dx) being 1-30% and ∫g(x)dx/(∫f(x)dx+∫g(x)dx+∫l(x)dx) being 1-50% in the interval [0, 1.0] of the analysis in the depth direction from the surface of the intermediate layer and ∫g(x)dx/(∫f(x)dx+∫g(x)dx+∫l(x)dx) being 40% or more in the interval [1.0, 4.0].

Inventors:
CHUGANJI MISATO (JP)
NAGAURA TOMOTA (JP)
Application Number:
JP2012/083722
Publication Date:
August 15, 2013
Filing Date:
December 26, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D1/04; C25D7/06; H05K1/09
Domestic Patent References:
WO2013031913A12013-03-07
Foreign References:
JP2005076091A2005-03-24
JP2004169181A2004-06-17
JP2002292788A2002-10-09
JPS5720347A1982-02-02
US0454381A1891-06-16
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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Claims: