Title:
COPPER FOIL WITH COPPER CARRIER, METHOD FOR PRODUCING SAID COPPER FOIL, COPPER FOIL FOR ELECTRONIC CIRCUIT, METHOD FOR PRODUCING SAID COPPER FOIL, AND METHOD FOR FORMING ELECTRONIC CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2012/132572
Kind Code:
A1
Abstract:
This copper foil with a copper carrier comprises a structure of a copper layer, a nickel layer, and a copper carrier comprising a rolled copper foil or an electrolytic copper foil, and is characterized by having the nickel layer on the copper carrier by means of delamination, delamination being possible at under 0.5 kg/cm, and simultaneously having the nickel layer on the copper layer side as well. The problem addressed by the present invention is to obtain an easily produced copper foil with a copper carrier, or the like, the foil being able to suppress the occurrence of sheet and circuit width flaws, increase etchability in pattern etching, and form a circuit having a uniform circuit width.
Inventors:
YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)
Application Number:
PCT/JP2012/053102
Publication Date:
October 04, 2012
Filing Date:
February 10, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)
YAMANISHI KEISUKE (JP)
KAMINAGA KENGO (JP)
FUKUCHI RYO (JP)
International Classes:
H05K1/09; C25D7/00; C25D7/06; H05K3/06
Foreign References:
| JP2001301087A | 2001-10-30 | |||
| JP2009114508A | 2009-05-28 | |||
| JP2003218524A | 2003-07-31 | |||
| JP2000021611A | 2000-01-21 | |||
| JP2002368365A | 2002-12-20 | |||
| JP2004330701A | 2004-11-25 | |||
| JP2001308477A | 2001-11-02 |
Attorney, Agent or Firm:
OGOSHI ISAMU (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
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Claims: