Title:
COPPER FOIL WITH CARRIER, METHOD FOR MANUFACTURING COPPER FOIL WITH CARRIER, COPPER FOIL WITH CARRIER FOR PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2013/146717
Kind Code:
A1
Abstract:
Provided is a copper foil for a printed circuit board, characterized in that the copper foil has a roughened layer on at least one surface thereof, and that in the layer the average diameter (D1) of a particle base at a position at 10% of the particle length is 0.2-1.0 µm, and the ratio (L1/D1) of particle length (L1) to the particle base average diameter (D1) is 15 or below. The copper foil for the printed circuit board is characterized in that after the copper foil for the printed circuit board having the roughened layer is layered with a resin, the copper layer is removed from the surface of the resin by etching, and the total area accounted for by holes in the roughened resin surface with irregularities is at least 20%. The present invention involves the development of a copper foil for a semiconductor package substrate in which without causing deterioration of the other properties of the copper foil, the phenomenon of circuit erosion is avoided. Specifically, the purpose of the present invention is to provide a copper foil for a printed circuit board and a method for manufacturing the same whereby the roughened layer of the copper foil is improved and the adhesion strength of the copper foil and the resin can be enhanced.
Inventors:
NAGAURA TOMOTA (JP)
KOHIKI MICHIYA (JP)
MORIYAMA TERUMASA (JP)
KOHIKI MICHIYA (JP)
MORIYAMA TERUMASA (JP)
Application Number:
PCT/JP2013/058653
Publication Date:
October 03, 2013
Filing Date:
March 26, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B32B15/01; B32B3/30; H05K1/09; H05K3/06; H05K3/24
Domestic Patent References:
| WO2009145207A1 | 2009-12-03 | |||
| WO2004005588A1 | 2004-01-15 |
Foreign References:
| JP2006103189A | 2006-04-20 | |||
| JP2010013738A | 2010-01-21 | |||
| JP2005048277A | 2005-02-24 | |||
| JP2001062955A | 2001-03-13 | |||
| JP2005193400A | 2005-07-21 | |||
| JPH08236930A | 1996-09-13 | |||
| JP3459964B2 | 2003-10-27 | |||
| JPS5135711B1 | 1976-10-04 | |||
| JPS546701B1 | 1979-03-30 | |||
| JP3306404B2 | 2002-07-24 | |||
| JP2002170827A | 2002-06-14 | |||
| JPH03122298A | 1991-05-24 |
Other References:
See also references of EP 2826623A4
Attorney, Agent or Firm:
OGOSHI Isamu et al. (JP)
Isamu Ogoshi (JP)
Isamu Ogoshi (JP)
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