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Patent Searching and Data


Title:
COPPER FOIL WITH CARRIER AND METHOD OF MANUFACTURING PRINTED WIRING BOARD BY USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/067422
Kind Code:
A1
Abstract:
Provided is a copper foil with carrier which can prevent foreign matter from attaching to an ultrathin copper layer surface in a printed wiring board manufacturing (e.g., a coreless technique, etc.), and also prevent a scratching on the ultrathin copper layer and damage of a roughened surface when peeling a protective layer, and in which no residue remains on the ultrathin copper layer surface after peeling the protective layer. The copper foil with carrier is provided with a carrier layer, a peeling layer, and an ultrathin copper layer, in that order. The copper foil with carrier is further provided with a protective layer on the ultrathin copper layer, and the protective layer is bonded to the ultrathin copper layer in at least one protective layer bonding area and is not bonded to the ultrathin copper layer in regions other than the protective layer bonding area.

Inventors:
IIDA HIROTO (JP)
TATEOKA AYUMU (JP)
Application Number:
PCT/JP2014/078959
Publication Date:
May 06, 2016
Filing Date:
October 30, 2014
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B15/00; H05K1/09; H05K3/46
Domestic Patent References:
WO2012133638A12012-10-04
Foreign References:
JPH05329981A1993-12-14
JP2001260274A2001-09-25
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Masaharu Takamura (JP)
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