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Title:
COPPER FOIL WITH CARRIER
Document Type and Number:
WIPO Patent Application WO/2014/080959
Kind Code:
A1
Abstract:
 Provided is a copper foil with carrier that is suitable for fine pitch formation. The copper foil with carrier is equipped with, in the following order, a carrier, a release layer, an ultra thin copper layer, and an optional resin layer. The average value of the roughness (Rz) of the surface of the ultra thin copper layer as measured in accordance with JIS B0601-1982 using a contact roughness meter is at most 1.5μm, and the standard deviation of the roughness (Rz) is at most 0.1μm.

Inventors:
KOHIKI,Michiya (Hitachi WorksJX Nippon Mining & Metals Corporation,3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
NAGAURA,Tomota (Hitachi WorksJX Nippon Mining & Metals Corporation,3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
SAKAGUCHI,Kazuhiko (Hitachi WorksJX Nippon Mining & Metals Corporation,3-1,Shirogane-cho 3-chome,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2013/081327
Publication Date:
May 30, 2014
Filing Date:
November 20, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORPORATION (6-3Otemachi 2-chome, Chiyoda-ku Tokyo, 64, 〒1008164, JP)
International Classes:
C25D7/06; C25D1/04; H05K1/09
Domestic Patent References:
WO2012046804A12012-04-12
WO2012066991A12012-05-24
WO2010110061A12010-09-30
Foreign References:
JP2008285751A2008-11-27
JP2007146289A2007-06-14
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (Shimbashi i-mark Bldg, 6-2 Shimbashi 2-Chome Minato-k, Tokyo 04, 〒1050004, JP)
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