Title:
COPPER FOIL WITH CARRIER
Document Type and Number:
WIPO Patent Application WO/2019/131000
Kind Code:
A1
Abstract:
Provided is an ultrathin copper foil with a carrier, which is capable of maintaining stable releasability even after being heated at a high temperature of 350°C or more for a long period of time. This ultrathin copper foil with a carrier is provided with: a carrier which is configured from a glass material or a ceramic material; an intermediate layer which is provided on the carrier and is configured from at least one metal that is selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga and Mo; a release layer which is provided on the intermediate layer and contains a carbon layer and a metal oxide layer, or which alternatively contains a metal oxide and carbon; and an ultrathin copper layer which is provided on the release layer.
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Inventors:
ISHII RINTARO (JP)
YANAI TAKENORI (JP)
MATSUURA YOSHINORI (JP)
YANAI TAKENORI (JP)
MATSUURA YOSHINORI (JP)
Application Number:
PCT/JP2018/044391
Publication Date:
July 04, 2019
Filing Date:
December 03, 2018
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B7/06; B32B15/04; B32B17/06; B32B18/00; C23C14/06; C23C28/00
Domestic Patent References:
| WO2017149811A1 | 2017-09-08 | |||
| WO2017150283A1 | 2017-09-08 | |||
| WO2016043058A1 | 2016-03-24 | |||
| WO2016174970A1 | 2016-11-03 | |||
| WO2002024444A1 | 2002-03-28 |
Foreign References:
| JP2008255462A | 2008-10-23 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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