Title:
COPPER FOIL WITH RESISTIVE LAYER, PRODUCTION METHOD THEREFOR, AND LAYERED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/007704
Kind Code:
A1
Abstract:
Provided is a copper foil with a resistive layer that has minimal resistance value variation as a resistive element, is capable of sufficiently maintaining adhesion to the resin substrate upon which the foil is layered, and is provided with superior properties as a resistive element for rigid and flexible substrates. In the copper foil with a resistive layer, a metal layer or an alloy layer acting as the resistive element is disposed upon one surface of the copper foil and the surface of said metal layer or alloy layer is roughened by means of nickel particles. In the method for producing the copper foil with a resistive layer, a resistive layer that comprises phosphorus-containing nickel is disposed upon the matted surface of an electrolytic copper foil that is provided with crystals comprising columnar grains, wherein the body of the matted surface has an Rz value prescribed by JIS-B-0601 in the range from 2.5 to 6.5μm; the surface of said resistive layer is roughened by means of nickel particles, wherein the roughness has an Rz value prescribed by JIS-B-0601 in the range from 4.5 to 8.5μm; and the alloy layer is formed from phosphorus-containing nickel, or the like.
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Inventors:
OGURO RYOICHI (JP)
KASE KOUJI (JP)
HOSHINO KAZUHIRO (JP)
KASE KOUJI (JP)
HOSHINO KAZUHIRO (JP)
Application Number:
PCT/JP2010/061550
Publication Date:
January 20, 2011
Filing Date:
July 07, 2010
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
OGURO RYOICHI (JP)
KASE KOUJI (JP)
HOSHINO KAZUHIRO (JP)
OGURO RYOICHI (JP)
KASE KOUJI (JP)
HOSHINO KAZUHIRO (JP)
International Classes:
C25D7/06; C23C28/00; C25D5/14; H05K1/09
Foreign References:
| JP2004176101A | 2004-06-24 | |||
| JP2004169118A | 2004-06-17 | |||
| JP2008184633A | 2008-08-14 |
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
Takahisa Sato (JP)
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