Title:
COPPER INK, CONDUCTIVE FILM FORMATION METHOD, AND RF TAG
Document Type and Number:
WIPO Patent Application WO/2023/248485
Kind Code:
A1
Abstract:
In the present invention, a low-resistance conductive film is formed on a paper base material. A copper ink according to the present invention comprises copper fine particles, a liquid dispersion medium, and a dispersant which disperses the copper fine particles in the dispersion medium. The copper fine particles are particles of copper having a median diameter of 60-110 nm. The concentration of copper fine particles is not less than 60 wt% with respect to the entirety of the copper ink. The dispersion medium contains an alcohol having a plurality of hydroxy groups. The dispersant is a polymer compound having a phosphate group, or a salt thereof. The concentration of the dispersant is 3-6 wt% with respect to the weight of the copper. The copper ink forms a conductive film of a paper base material via optical firing.
Inventors:
KAWATO YUICHI (JP)
MINAMIHARA SATOSHI (JP)
ARIMURA HIDETOSHI (JP)
MINAMIHARA SATOSHI (JP)
ARIMURA HIDETOSHI (JP)
Application Number:
PCT/JP2022/031645
Publication Date:
December 28, 2023
Filing Date:
August 23, 2022
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
C09D5/24; H01B1/22; H01B13/00; H05K1/09
Domestic Patent References:
| WO2017057301A1 | 2017-04-06 |
Foreign References:
| JP2013104089A | 2013-05-30 | |||
| JP2013105605A | 2013-05-30 | |||
| JP2013175559A | 2013-09-05 | |||
| JP2014222611A | 2014-11-27 | |||
| JP2018147658A | 2018-09-20 |
Attorney, Agent or Firm:
NOGUCHI Yasuhiro (JP)
Download PDF: