Title:
COPPER INK AND METHOD FOR FORMING ELECTROCONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2021/192523
Kind Code:
A1
Abstract:
A copper ink for forming electroconductive films through burning, the copper ink being printable by screen printing on substrates and forming electroconductive films having reduced electrical resistance. The copper ink is for burning in a formic acid atmosphere, and comprises: fine copper particles; a dispersion medium which contains the fine copper particles; and a dispersant with which the fine copper particles are dispersed in the dispersion medium. The fine copper particles include ones having a median diameter of 10-100 nm. The dispersion medium includes an organic solvent having a hydroxy group. The dispersant is a polymer.
Inventors:
MITA TOMOHIRO (JP)
KAWATO YUICHI (JP)
ARIMURA HIDETOSHI (JP)
KAWATO YUICHI (JP)
ARIMURA HIDETOSHI (JP)
Application Number:
PCT/JP2021/000997
Publication Date:
September 30, 2021
Filing Date:
January 14, 2021
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
C09C1/66; C09D11/023; C09D11/033; C09D11/08; C09D11/52; C09D17/00; H01B1/22; H01B13/00
Domestic Patent References:
| WO2017159611A1 | 2017-09-21 |
Foreign References:
| JP2020009554A | 2020-01-16 | |||
| JP2013175559A | 2013-09-05 |
Attorney, Agent or Firm:
NOGUCHI, Yasuhiro (JP)
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