COPPER MATERIAL FOR PLATING, PROCESS FOR PRODUCING COPPER MATERIAL FOR PLATING, AND PROCESS FOR PRODUCING COPPER-PLATED MATERIAL

Title:

COPPER MATERIAL FOR PLATING, PROCESS FOR PRODUCING COPPER MATERIAL FOR PLATING, AND PROCESS FOR PRODUCING COPPER-PLATED MATERIAL

Document Type and Number:

WIPO Patent Application WO/2010/079735

Kind Code:

A1

Abstract:

A copper material for plating which comprises a coil constituted of a spirally wound copper wire. A process for producing a copper material for plating is provided which comprises the step of supplying a copper wire, the step of winding the supplied copper wire into a coil, and the step of cutting the copper wire after the coil has been formed in a given length. A process for producing a copper-plated material is also provided, one embodiment of which comprises a step in which a material to be plated is immersed as a cathode in a plating tank containing a plating solution and a soluble anode is also immersed and a step in which a voltage is applied between the soluble anode and the cathode to electrodeposit copper on the surface of the material to be plated, the soluble anode being the copper material for plating. Another embodiment of the process for producing a copper-plated material comprises a step in which a material to be plated is immersed as a cathode in a plating tank containing a plating solution and an insoluble anode is also immersed and a step in which a voltage is applied between the insoluble anode and the cathode to electrodeposit copper on the surface of the material to be plated, wherein the plating solution is yielded by dissolving the copper material for plating and thereby supplying copper ions, and the plating solution is fed to the plating tank.

Inventors:

WADA KEIJI (JP)
KATO NAOKI (JP)
NAKAYA KIYOTAKA (JP)
AKIYAMA YOSHIYUKI (JP)
OKADA KOHEI (JP)

Application Number:

PCT/JP2010/000014

Publication Date:

July 15, 2010

Filing Date:

January 05, 2010

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)
WADA KEIJI (JP)
KATO NAOKI (JP)
NAKAYA KIYOTAKA (JP)
AKIYAMA YOSHIYUKI (JP)
OKADA KOHEI (JP)

International Classes:

C25D17/12; C25D21/14

Foreign References:

JPS5432138A	1979-03-09
JP2006214008A	2006-08-17

Attorney, Agent or Firm:

SHIGA, Masatake et al. (JP)
Masatake Shiga (JP)

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