COPPER MICROPARTICLE AND PROCESS FOR PRODUCING THE SAME

Title:

COPPER MICROPARTICLE AND PROCESS FOR PRODUCING THE SAME

Document Type and Number:

WIPO Patent Application WO/2006/019144

Kind Code:

A1

Abstract:

Copper microparticles that are fine and contain substantially none of agglomerated particles. For example, there are provided copper microparticles of 0.005 to 2.0 μm average particle diameter (D) as measured by an electron microscope, 0.005 to 2.0 μm average particle diameter (d) as measured by a dynamic light scattering particle size distribution measuring apparatus and 0.7 to 2 d/D ratio. There is provided a process comprising mixing a divalent copper oxide with a reducing agent in the presence of a complexing agent and a protective colloid in a liquid medium to thereby produce copper microparticles without formation of a univalent copper oxide from the divalent copper oxide. Further, there is provided a process comprising reducing a divalent copper oxide in the presence of a complexing agent and a protective colloid, such as a protein, to thereby form metallic copper microparticles, adding a protective colloid scavenger, such as a protease, to thereby remove the protective colloid and effect agglomeration of metallic copper microparticles, and filtering the mixture by means of a pressure filter, a vacuum filter, a suction filter, etc.

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Inventors:

TOMONARI MASANORI (JP)
HONMA MASATOSHI (JP)
KUNIFUSA YOSHIYUKI (JP)

Application Number:

PCT/JP2005/015087

Publication Date:

February 23, 2006

Filing Date:

August 18, 2005

Export Citation:

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Assignee:

ISHIHARA SANGYO KAISHA (JP)
TOMONARI MASANORI (JP)
HONMA MASATOSHI (JP)
KUNIFUSA YOSHIYUKI (JP)

International Classes:

B22F1/00; B22F9/24

Domestic Patent References:

WO2002013999A1

2002-02-21

Foreign References:

JP2004256857A	2004-09-16
JPS6155562B2	1986-11-28
JPH09241709A	1997-09-16
JPH04235205A	1992-08-24
JPH0234708A	1990-02-05

Other References:

None
See also references of EP 1787742A4

Attorney, Agent or Firm:

Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, JP)

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