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Title:
COPPER NANOPARTICLES AND PRODUCTION METHOD FOR SAME, COPPER NANOPARTICLE FLUID DISPERSION, COPPER NANOINK, COPPER NANOPARTICLE PRESERVATION METHOD, AND COPPER NANOPARTICLE SINTERING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/129466
Kind Code:
A1
Abstract:
 A principal purpose of the present invention is to provide copper nanoparticles with which oxidation of the copper is minimized; which, due to an average particle diameter of 10 nm or smaller, have a markedly lowered melting point, and moreover are highly dispersible and sinterable at low temperature; with which a protective layer can be eliminated during low-temperature sintering at 150°C or below; and which are suitable for use as a conductive copper nanoink material; as well as a copper nanoparticle preservation method by which copper nanoparticles can be stably preserved for extended periods at room temperature, and transported. The present invention provides copper nanoparticles formed of a center portion comprising a copper single crystal and a protective layer on the perimeter thereof, wherein the copper nanoparticles are characterized in that (1) the average particle diameter of the copper nanoparticles is 10 nm or less, (2) the protective layer includes at least one compound selected from C3-6 primary alcohols, C3-6 secondary alcohols, and derivatives thereof, and (3) the boiling point or thermal decomposition point of the protective layer is 150°C or lower.

Inventors:
KAWASAKI HIDEYA (JP)
ARAKAWA RYUICHI (JP)
HOKITA YUKI (JP)
Application Number:
PCT/JP2015/053833
Publication Date:
September 03, 2015
Filing Date:
February 12, 2015
Export Citation:
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Assignee:
SCHOOL CORP KANSAI UNIV (JP)
International Classes:
B22F1/054; B22F1/102; B22F1/107; B22F9/00; B82Y30/00; B82Y40/00; B22F9/24
Domestic Patent References:
WO2013035366A12013-03-14
WO2012147945A12012-11-01
WO2009090748A12009-07-23
WO2009090767A12009-07-23
Foreign References:
JP2013007076A2013-01-10
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
Patent business corporation 3 Edakuni [Hajime] patent firm (JP)
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