COPPER-NICKEL ALLOY ELECTROPLATING BATH

Title:

COPPER-NICKEL ALLOY ELECTROPLATING BATH

Document Type and Number:

WIPO Patent Application WO/2016/021369

Kind Code:

A1

Abstract:

The present invention provides a copper-nickel alloy electroplating bath which contains (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a conductivity imparting agent, (d) a sulfur-containing organic compound and (e) a redox potential regulator.

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Inventors:

SAKURAI HITOSHI (JP)
ONO KAZUNORI (JP)
HASHIMOTO AKIRA (JP)
YUASA SATOSHI (JP)

Application Number:

PCT/JP2015/069944

Publication Date:

February 11, 2016

Filing Date:

July 10, 2015

Export Citation:

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Assignee:

DIPSOL CHEM (JP)

International Classes:

C25D3/58; C25D3/56

Domestic Patent References:

WO2013157639A1

2013-10-24

Foreign References:

JPS58133391A	1983-08-09
JPH0598488A	1993-04-20
JPH02285091A	1990-11-22

Other References: