Title:
COPPER AND/OR COPPER OXIDE DISPERSION, AND ELECTROCONDUCTIVE FILM FORMED USING DISPERSION
Document Type and Number:
WIPO Patent Application WO/2015/012264
Kind Code:
A1
Abstract:
To provide a copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor.
The copper and/or copper oxide dispersion contains 0.50-60 mass% of copper and/or copper oxide microparticles and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass% of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20°C; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20°C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate.
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Inventors:
OGAWA SHIMPEI (JP)
OHNO EIICHI (JP)
TSURUTA MASANORI (JP)
OHNO EIICHI (JP)
TSURUTA MASANORI (JP)
Application Number:
PCT/JP2014/069321
Publication Date:
January 29, 2015
Filing Date:
July 22, 2014
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
H01B5/14; C09C1/62; C09D11/03; C09D11/52; H01B1/20; H01L21/288; H01L29/786; H05K1/09; H05K3/12
Domestic Patent References:
| WO2008111484A1 | 2008-09-18 | |||
| WO2013073200A1 | 2013-05-23 | |||
| WO2012115475A2 | 2012-08-30 |
Foreign References:
| JP2013109966A | 2013-06-06 | |||
| JP2010129790A | 2010-06-10 | |||
| JP2013503234A | 2013-01-31 | |||
| JP2005015628A | 2005-01-20 | |||
| JP2012216425A | 2012-11-08 |
Other References:
See also references of EP 3026677A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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