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Title:
COPPER OXIDE INK AND METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE USING SAME, PRODUCT CONTAINING COATING FILM AND METHOD FOR PRODUCING PRODUCT USING SAME, METHOD FOR PRODUCING PRODUCT WITH CONDUCTIVE PATTERN, AND PRODUCT WITH CONDUCTIVE PATTERN
Document Type and Number:
WIPO Patent Application WO/2019/022230
Kind Code:
A1
Abstract:
In the present invention, a conductive film having low resistance is formed on a substrate, said film having excellent storage stability and high dispersion stability as an ink. A copper oxide ink (1) contains a copper oxide (2), a dispersant (3), and a reducing agent. The content of the reducing agent is in the range of formula (1), and the content of the dispersant is in the range of formula (2). (1) 0.00010 ≤ (reducing agent mass/copper oxide mass) ≤ 0.10 (2) 0.0050 ≤ (dispersant mass/copper oxide mass) ≤ 0.30 The reducing agent content promotes the reduction of copper oxide to copper during firing, and promotes the sintering of copper.

Inventors:
TSURUTA, Masanori (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
YUMOTO, Toru (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
Application Number:
JP2018/028238
Publication Date:
January 31, 2019
Filing Date:
July 27, 2018
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
International Classes:
C09D11/52; H01B1/02; H01B1/22; H01B13/00; H05K3/12
Domestic Patent References:
WO2014119498A12014-08-07
Foreign References:
EP3127969A12017-02-08
JP2004253794A2004-09-09
JP2015210973A2015-11-24
JP2009283547A2009-12-03
JP2004119686A2004-04-15
JPH0714427A1995-01-17
JP2013115004A2013-06-10
JPH01220303A1989-09-04
JP2016527665A2016-09-08
JP2007080720A2007-03-29
JP2015018675A2015-01-29
Attorney, Agent or Firm:
AOKI, Hiroyoshi et al. (5F JS Ichigaya Bldg, 5-1 Goban-cho, Chiyoda-k, Tokyo 76, 〒1020076, JP)
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