Title:
COPPER OXIDE PASTE AND METHOD FOR PRODUCING ELECTRONIC PARTS
Document Type and Number:
WIPO Patent Application WO/2021/060503
Kind Code:
A1
Abstract:
Provided is a copper-based paste capable of bonding a chip component and a substrate more firmly and obtaining a copper-based bonding material having high thermal conductivity. This copper oxide paste includes copper-containing particles, a binder resin, and an organic solvent. The copper-containing particles contain Cu2O and CuO. The total amount of copper element constituting Cu2O and copper element constituting CuO is 90% or more of the copper element contained in the copper-containing particles. The copper-containing particles have a 50% cumulative particle size (D50) of 0.20-5.0 μm inclusive; the 50% cumulative particle size (D50) and the 10% cumulative particle size (D10) satisfy 1.3 ≦ D50/D10 ≦ 4.9; the 50% cumulative particle size (D50) and the 90% cumulative particle size (D90) satisfy 1.2 ≦ D90/D50 ≦ 3.7, and the BET specific surface area of the copper-containing particles is 1.0 m2/g to 8.0 m2/g inclusive.
Inventors:
KOIKE JUNICHI (JP)
HOANG TRI HAI (JP)
HOANG TRI HAI (JP)
Application Number:
PCT/JP2020/036384
Publication Date:
April 01, 2021
Filing Date:
September 25, 2020
Export Citation:
Assignee:
MAT CONCEPT INC (JP)
International Classes:
C09D17/00; H01B1/20; H01B1/22; H01L21/52
Domestic Patent References:
| WO2015194366A1 | 2015-12-23 | |||
| WO2018131095A1 | 2018-07-19 |
Foreign References:
| JP2017069201A | 2017-04-06 | |||
| JP2016126877A | 2016-07-11 | |||
| JPH0229632B2 | 1990-07-02 |
Other References:
See also references of EP 4036181A4
Attorney, Agent or Firm:
IWAIKE Mitsuru et al. (JP)
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