Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COPPER PASTE, BONDING METHOD, AND METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/188511
Kind Code:
A1
Abstract:
This copper paste comprises metal particles and a dispersion medium. The metal particles comprise type-1 particles and type-2 particles. The type-1 particles are copper particles having nanostructures on the surfaces thereof, and having an average particle diameter of 1-100 μm. The type-2 particles are copper particles having an average particle diameter of 0.05-5 μm. The average particle diameter of the type-1 particles is 2-550 times the average particle diameter of the type-2 particles. For example, a laminate, in which a copper paste(5) is provided between a first member(1) and a second member(2), is heated in a reducing atmosphere to sinter the copper paste, whereby the first member and the second member can be bonded without processing.

Inventors:
NAKAJO, Haruyuki (HARIMA CHEMICALS INC., 9-3, Tokodai 5-chome, Tsukuba-sh, Ibaraki 35, 〒3002635, JP)
OGAWA, Takayuki (HARIMA CHEMICALS INC., 9-3, Tokodai 5-chome, Tsukuba-sh, Ibaraki 35, 〒3002635, JP)
ZHANG, Ya (HARIMA CHEMICALS INC., 9-3, Tokodai 5-chome, Tsukuba-sh, Ibaraki 35, 〒3002635, JP)
Application Number:
JP2019/011213
Publication Date:
October 03, 2019
Filing Date:
March 18, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HARIMA CHEMICALS, INC. (671-4, Mizuashi Noguchi-cho, Kakogawa-sh, Hyogo 19, 〒6750019, JP)
International Classes:
B22F1/00; H01B1/00; H01B1/22
Foreign References:
JPH1021744A1998-01-23
JP2011094236A2011-05-12
Attorney, Agent or Firm:
SHINTAKU, Masato (IZANAGI IP LAW FIRM, Toa Bldg. 5-7, Minamihonmachi 4-chome, Chuo-ku, Osaka-sh, Osaka 54, 〒5410054, JP)
Download PDF: