Title:
COPPER PASTE FOR JOINING, METHOD FOR JOINING BODY TO BE JOINED, METHOD FOR PRODUCING JOINED BODY, AND METHOD FOR PRODUCING COPPER PASTE FOR JOINING
Document Type and Number:
WIPO Patent Application WO/2023/210449
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide copper paste for joining that suppresses voids which can occur in a coating film firing step and that can achieve a sufficiently high joining ratio between bodies to be joined. Provided is a copper paste for joining that comprises a solvent and two or more types of copper powders with differing particle sizes, wherein: in one of the types of copper powder, the increase ratio (D2-D1)/D1×100 of a crystallite size D2 (nm) at 250°C with respect to a crystallite size D1 (nm) at 150°C is not less than 5%; the boiling point of the solvent is not lower than 150°C but lower than 300°C; and the proportion of the entire amount of the copper powders with respect to 100 mass% of the copper paste is not less than 88 mass%.
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Inventors:
KONNO SATOSHI (JP)
YAMAUCHI SHINICHI (JP)
ANAI KEI (JP)
YAMAUCHI SHINICHI (JP)
ANAI KEI (JP)
Application Number:
PCT/JP2023/015511
Publication Date:
November 02, 2023
Filing Date:
April 18, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
B22F9/00; B22F1/00; B22F1/052; B22F1/065; B22F1/102; B22F7/08; H01L21/52
Domestic Patent References:
| WO2020032161A1 | 2020-02-13 |
Foreign References:
| JP2019002054A | 2019-01-10 | |||
| JP2014167145A | 2014-09-11 | |||
| JP2017157329A | 2017-09-07 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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