COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Title:

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2017/043541

Kind Code:

A1

Abstract:

This copper paste for joining includes metal particles and a dispersant. The metal particles include sub- copper microparticles having a volume average particle diameter of 0.12-0.8 μm inclusive and flake-shaped copper microparticles having a maximum diameter of 1-20 μm inclusive and an aspect ratio of 4 or higher. The amount of copper microparticles included in the metal particles and having a maximum diameter of 1-20 μm inclusive and an aspect ratio of less than 2 is 50% by mass or less expressed in terms of the total amount of the flake-shaped copper microparticles.

Inventors:

ISHIKAWA DAI (JP)
KAWANA YUKI (JP)
SUGAMA CHIE (JP)
NAKAKO HIDEO (JP)
EJIRI YOSHINORI (JP)
KURAFUCHI KAZUHIKO (JP)

Application Number:

PCT/JP2016/076333

Publication Date:

March 16, 2017

Filing Date:

September 07, 2016

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

B22F7/08; B22F1/00; B22F1/068; C04B37/02; H01B1/00; H01B1/22; H01L21/52

Domestic Patent References:

WO2008062548A1	2008-05-29
WO2015098658A1	2015-07-02

Foreign References:

JP2013247060A	2013-12-09
JP2014167145A	2014-09-11
JP2005200734A	2005-07-28
JP2014222619A	2014-11-27

Other References: