Title:
COPPER PASTE SINTERABLE AT LOW TEMPERATURE AND HIGH DENSITY
Document Type and Number:
WIPO Patent Application WO/2020/224257
Kind Code:
A1
Abstract:
A copper paste which can be used for low-temperature sintering and can obtain a low porosity, the copper paste comprising: spherical copper particles, sheet-shaped copper particles, sheet-shaped indium particles and a highly-linked resin. The ratio of the two types of copper particles is more than 80%, the ratio of the indium particles is between 10-20%, and the ratio of the highly-linked resin is between 0-10%. In a pressure-free state, the sintering temperature of a copper paste body may be as low as about 180-250°C, and the density of the copper paste body is above 95% after being sintered.
Inventors:
ZHANG WEIHONG (CN)
YE HUAIYU (CN)
LIU XU (CN)
ZHANG GUOQI (CN)
YE HUAIYU (CN)
LIU XU (CN)
ZHANG GUOQI (CN)
Application Number:
PCT/CN2019/123818
Publication Date:
November 12, 2020
Filing Date:
December 06, 2019
Export Citation:
Assignee:
SHENZHEN INST OF WIDE BANDGAP SEMICONDUCTORS (CN)
International Classes:
B22F1/00; B22F3/10
Foreign References:
| CN109926577A | 2019-06-25 | |||
| JP2005222737A | 2005-08-18 | |||
| JP2003123537A | 2003-04-25 | |||
| CN106457386A | 2017-02-22 | |||
| CN107405691A | 2017-11-28 |
Attorney, Agent or Firm:
BEIJING ZZFY INTELLECTUAL PROPERTY LAW FIRM (GENERAL PARTNER) (CN)
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