Title:
COPPER PASTE
Document Type and Number:
WIPO Patent Application WO/2024/034662
Kind Code:
A1
Abstract:
A copper paste according to the present invention contains copper powder and an alcohol solvent. The alcohol solvent contains at least one first alcohol selected from the group consisting of monovalent alcohols and divalent alcohols having a viscosity of 3-70 mPa·s at 25°C, and at least one second alcohol selected from the group consisting of divalent alcohols and trivalent alcohols having a viscosity of 300-1000 mPa·s at 25°C. The copper paste exhibits a viscosity η10 of 1-50 Pa·s at 25°C at a shear rate of 10 s-1. The square root √σ0 of the Casson yield stress σ0 of the copper paste is 10 Pa1/2 or less.
Inventors:
KOIKE JUNICHI (JP)
Application Number:
PCT/JP2023/029240
Publication Date:
February 15, 2024
Filing Date:
August 10, 2023
Export Citation:
Assignee:
MAT CONCEPT INC (JP)
International Classes:
H01B1/22; B22F1/00; B22F1/052; B22F1/054; B22F1/0545; B22F1/06; B22F1/068; B22F1/102; B22F1/107; B22F7/08; B22F9/00; H05K3/12
Foreign References:
| JP2017157633A | 2017-09-07 | |||
| JP2013107799A | 2013-06-06 |
Attorney, Agent or Firm:
SEINO Yuki (JP)
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