COPPER-POLYIMIDE LAMINATE, THREE-DIMENSIONAL MOLDING BODY, AND METHOD FOR PRODUCING THREE-DIMENSIONAL MOLDING BODY

WIPO Patent Application WO/2013/108431

A1

[Problem] To provide: a copper-polyimide laminate with which three-dimensional molding is possible without rupturing either a thermoplastic polyimide film or a copper foil; a three-dimensional molding body; and a method for producing the three-dimensional molding body. [Solution] This copper-polyimide laminate is obtained by bonding a rolled copper foil and a thermoplastic polyimide film by means of an adhesion layer comprising a thermoplastic polyimide. The rolled copper foil contains 50 to 300 ppm of silver and 100 to 300 ppm of oxygen in terms of mass ratio, with the remainder comprising copper and unavoidable impurities. The thermoplastic polyimide film is obtained by subjecting aromatic tetracarboxylic dianhydride and an aromatic diamine to condensation polymerization, and has a glass transition temperature of 260°C to less than 320°C, and a storage elastic modulus at 25°C to 200°C of 1 × 109 to 4 × 109 Pa. The thermoplastic polyimide has a glass transition temperature of 200°C to less than 260°C, and a storage elastic modulus at 25°C to 200°C of 1 × 109 to 4 × 109 Pa.

ONO TOSHIYUKI (JP)
KAMMURI KAZUKI (JP)
MACHIDA HIDEAKI (JP)
KURIBARA HITOSHI (JP)

PCT/JP2012/068644

July 25, 2013

July 24, 2012

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JX NIPPON MINING & METALS CORP (JP)
TORAY DU PONT KK (JP)
ONO TOSHIYUKI (JP)
KAMMURI KAZUKI (JP)
MACHIDA HIDEAKI (JP)
KURIBARA HITOSHI (JP)

B32B15/088; H05K1/02; H05K1/03; H05K1/09

JP2007005003A	2007-01-11
JP2005340184A	2005-12-08
JP2000212661A	2000-08-02
JP2010100887A	2010-05-06
JP2002240195A	2002-08-28
JP2000103010A	2000-04-11
JP2004261961A	2004-09-24
JP2008144049A	2008-06-26
JP2003151328A	2003-05-23

AKAO Kenichiro et al. (JP)
Ken-ichiro Akao (JP)

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